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d a t a sh eet product speci?cation supersedes data of 1997 jul 03 file under integrated circuits, ic02 1999 jun 15 integrated circuits PCA8521 infrared remote control transmitter rc5
1999 jun 15 2 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 features rc5 protocol maximum of: C 56 keys (20-pin version) C 30 keys (16-pin version). option of multi-system or single system transmitter C multi-system: maximum 8 systems, selection by key C single system: maximum 8 different systems per ic, selection by jumper wire or switch. power-down and key wake-up high output current ( 45 ma) oscillator frequency of 432 khz or 4 mhz multiple key protection option of 25% or 33% duty factor contained in dip16, so16, dip20 or so20 packages. general description the PCA8521 can be used in infrared remote control transmitters. it generates output pulses, in accordance with the rc5 protocol, when a key is pressed. the ic does not contain a software programmable processor. however, it does contain a rom in which the codes that have to be transmitted are stored. an example of an application diagram using a 20-pin ic is illustrated in fig.7. the oscillator frequency may be optionally chosen as 432 khz or 4 mhz. for 432 khz additional external capacitors must be connected. the capacitors for a 4 mhz oscillator is integrated. when a key in the key-matrix is pressed a drive line will be connected to a sense line. this causes the oscillator to start and a corresponding code will be generated conforming to the rc5 protocol. seven drive lines ( dr0 to dr6) and eight sense lines (sn0 to sn7) may be connected via the key matrix to scan the keys (see fig.1). when two or more keys are activated simultaneously no transmission will take place. ordering information type number package name description version PCA8521fp dip16 plastic dual in-line package; 16 leads (300 mil) sot38-4 PCA8521ft so16 plastic small outline package; 16 leads; body width 7.5 mm sot162-1 PCA8521bp dip20 plastic dual in-line package; 20 leads (300 mil) sot146-1 PCA8521bt so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1
1999 jun 15 3 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 block diagram fig.1 block diagram (for dip20 and so20 packages). mbh038 handbook, full pagewidth 432 khz or 4 mhz oscillator key scanning shift register 1k x 8 rom pulse generator stop timing generator and control 1 4 xtal1 xtal2 2 sn0 36 khz 5 sn1 6 sn2 7 sn3 9 sn4 10 sn5 output driver 8 sn6 3 sn7 16 dr1 15 14 13 12 11 17 dr2 dr3 dr4 dr5 dr6 dr0 19 lout 18 v ss v dd 20 PCA8521
1999 jun 15 4 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 pinning 16-pin dual in-line and small outline package symbol pin description xtal1 1 oscillator input xtal2 2 oscillator output sn0 3 sense line 0 for key matrix sn1 4 sense line 1 for key matrix sn2 5 sense line 2 for key matrix sn3 6 sense line 3 for key matrix sn4 7 sense line 4 for key matrix sn5 8 sense line 5 for key matrix dr4 9 drive line 4 for key matrix (active low) dr3 10 drive line 3 for key matrix (active low) dr2 11 drive line 2 for key matrix (active low) dr1 12 drive line 1 for key matrix (active low) dr0 13 drive line 0 for key matrix (active low) v ss 14 ground lout 15 output signal (active low) v dd 16 power supply fig.2 pin configuration (dip/so16). handbook, halfpage PCA8521 mbh032 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 xtal1 xtal2 sn0 sn1 sn2 sn3 sn4 sn5 v dd lout v ss dr0 dr1 dr2 dr3 dr4
1999 jun 15 5 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 20-pin dual in-line and small outline package symbol pin description xtal1 1 oscillator input xtal2 2 oscillator output sn7 3 sense line 7 for key matrix sn0 4 sense line 0 for key matrix sn1 5 sense line 1 for key matrix sn2 6 sense line 2 for key matrix sn3 7 sense line 3 for key matrix sn6 8 sense line 6 for key matrix sn4 9 sense line 4 for key matrix sn5 10 sense line 5 for key matrix dr5 11 drive line 5 for key matrix (active low) dr4 12 drive line 4 for key matrix (active low) dr3 13 drive line 3 for key matrix (active low) dr2 14 drive line 2 for key matrix (active low) dr1 15 drive line 1 for key matrix (active low) dr0 16 drive line 0 for key matrix (active low) dr6 17 drive line 6 for key matrix (active low) v ss 18 ground lout 19 output signal (active low) v dd 20 power supply fig.3 pin configuration (dip/so20). handbook, halfpage PCA8521 mbh033 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 xtal1 xtal2 sn7 sn0 sn1 sn2 sn3 sn6 sn4 sn5 v dd lout v ss dr6 dr0 dr1 dr2 dr3 dr4 dr5
1999 jun 15 6 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 functional description key numbering for the matrix is given in tables 1 and 2. table 1 key numbering for 16-pin package table 2 key numbering for 20-pin package driver lines sense lines sn0 sn1 sn2 sn3 sn4 sn5 dr0012345 dr1 8 9 10 11 12 13 dr2 16 17 18 19 20 21 dr3 24 25 26 27 28 29 dr4 32 33 34 35 36 37 driver lines sense lines sn0 sn1 sn2 sn3 sn4 sn5 sn6 sn7 dr0 01234567 dr1 8 9 10 11 12 13 14 15 dr2 16 17 18 19 20 21 22 23 dr3 24 25 26 27 28 29 30 31 dr4 32 33 34 35 36 37 38 39 dr5 40 41 42 43 44 45 46 47 dr6 48 49 50 51 52 53 54 55 when the keys have been scanned the key-number of the activated key serves as the address of the rom to obtain the required code-word. when a 16-pin ic is used the following sense lines and driver lines will not be connected; sn6, sn7, dr5 and dr6. consequently, key numbers 6, 7, 14, 15, 22, 23, 30, 31, 38, 39 and 40 to 55 will not be addressed. the rom contains 8 banks of 64 code-words. thus for each key a maximum of 8 different code-words may be generated. with multi-system use, 8 different systems (e.g. tv, vcr, tuner, cd etc.) may be selected. apart from the system bits the command bits may also be different in different banks (true multi-function keys). selection can be performed using the keys. for each key three bank select bits are present that determine which bank will be selected for the next key. for each key an inhibit bit is also present. when this bit is at logic 1 at an address in a given bank, and when the corresponding key is pressed (when this bank has been selected) no transmission will take place. a single system option is available however, whereby instead of keys a jumper wire and/or a switch may be used for bank selection. using this option it is possible to program different transmitter models in one ic and select the required bank by means of a jumper wire. instead of a jumper wire a side-switch may also be used to change the generated code temporarily (select different bank) to obtain multi-function keys. with this option the jumper wires or switch must be connected between sense line sn0 and one of the drive lines dr0 to dr6 or ground. this means that sn0 cannot be used to connect keys and the maximum number of keys will be 25 keys for a 16-pin package and 49 keys for a 20-pin package. it is not possible to use a combination of jumper wires and selection keys for bank selection in one unit. the output of the rom is loaded into a shift register that provides the input bits for the pulse generator. this pulse generator drives the output pin.
1999 jun 15 7 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 timing generator a schematic diagram of the timing generator is illustrated in fig.4. the oscillator frequency is 432 khz or 4 mhz. the timing generator is stopped when no key is activated and started again when a key is pressed. the output of the oscillator (clk1) is divided by 111 for 4 mhz or by 12 for 432 khz. selection is achieved using a mask option. the output of the divider is clk2 which is used for clocking of the control timer. the frequency of clk2 is 36 khz and the inverse is used to generate the output pulses in the subcarrier frequency. by mask option the duty factor can be chosen to be 25% or 33%. the control timer has a length of 4096 subcarrier (pulse) periods. this is equal to the transmission repetition time. a bit time is equal to 64 pulses and the repetition time is 64 bit times. the control timer provides the timing of the key scanning, the rom access and the code transmission. when the control timer has arrived at a certain state, and no key has been pressed for at least 28 ms, a stop signal will be generated which will stop the oscillator. all drive lines will then be set to logic 0. as soon as a key is pressed one of the sense lines will become logic 0. this will generate a start signal which will restart the oscillator. key scanning six bits of the control timer are used to control the key scanning, subsequently 64 time slots are available. each time slot corresponds to a key number. the 3 most significant bits (msbs) control the drive lines and the 3 least significant bits (lsbs) control the sense lines. the scan timing is illustrated in fig.5. in the first 8 time slots drive line dr0 is low. during this time the 8 sense lines sn0 to sn7 are sequentially tested. the same occurs for the next 8 time slots when dr1 is at logic 0 and so on until dr6 is at logic 0. after testing there are 8 time slots when no drive line is at logic 0 (all drive lines high). when, during time slots 0 to 63, one of the sense lines is at logic 0 the contents of the 6 bits is stored in the key register. this register is used to address the rom. no transmission will take place when two or more keys are activated. this situation is considered to be the same as no key and the control bit in the command word for the next transmission will be toggled. when no key is pressed the oscillator will stop at the end of the control timer (see section timing generator). in this situation all drive lines will be set to logic 0. when one of the keys is pressed again a wake-up will occur by starting the oscillator. an option is available to select single or multi system. single system sn0 should be connected to one of the drive lines or ground. the bank that will be selected is equal to drive line number to which sn0 is connected. when connected to ground the number will be 7. this is achieved by loading the bank select flip-flops bs0 to bs2 with the contents of c5 to c7 of the control timer (see fig.4) when sense line sn0 is at logic 0. in this way it is possible to use two different systems in one transmitter by using a side switch. with this option sn0 cannot be used to connect keys, so the maximum number of keys will be lower. (49 keys with 20-pin ic and 25 keys with 16-pin ic). multi system the bank is selected by key for maximum 8 different systems (e.g. tv, vcr, cd, etc.), any key is flexible for bank selection. when a user inserts a new battery, the default bank is always in bank 7. if only bank 7 is used, then maximum number of keys can be: 56 keys for a 20-pin ic 30 keys for 16-pin ic. rom a schematic diagram of the rom is illustrated in fig.6. the rom is divided into 8 banks of 2 64 bytes. bank selection is performed using flip-flops bs0 to bs2 that are the 3 highest bits of the address. with the single system these bits are loaded from the 3 msbs of the scan control when sn0 = 0. at power-on the bank select flip-flops will be in an arbitrary state. when a key was activated, the key number is stored in the 6-bit key register. this register forms the lower bits of the rom address. for each command the rom will be accessed twice. this gives 16 bits in total (m0l to m7l and m0h to m7h). the bits are described in table 3.
1999 jun 15 8 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 table 3 rom bit description pulse output the bits of the remote control word, as indicated by the addressed rom locations, are loaded into a shift register every bit-time this register is shifted. the output is used to generate a logic 0 or a logic 1 in the biphase (manchester) coding, modulated with a frequency of 36 khz. the duty factor of the modulation pulses may be selected (optionally) to be 25% or 33.3%. the output of the pulse generator controls the output driver that can provide a maximum current of 45 ma. bits function m0l to m5l command bits 0 to 5. m6l field bit. this bit indicates whether command codes 0 to 63 are used (field bit is at logic 1) or command codes 64 to 127 are used (field bit is at logic 0). m7l inhibit bit. when this bit is at logic 1 no transmission will take place. when this bit is at logic 0 the appropriate code-word will be transmitted. m0h to m4h system bits 0 to 4. m5h to m7h bank select. will be stored in bs0 to bs2 when the multi-system option is selected. with single system bits m5h to m7h are don't care. fig.4 timer schematic diagram. handbook, full pagewidth mbh035 432 khz or 4 mhz oscillator s q clk r q clr start input no key end control clk1 clk2 inv stop 432 khz 4 mhz divide by 111 divide by 12 control timer divide-by-4096 pulse c0 c11
1999 jun 15 9 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 fig.5 scan timing. handbook, full pagewidth mbh037 dr0 dr1 dr2 dr3 dr4 dr5 dr6 sn0 sn1 sn2 sn3 sn4 sn5 sn6 sn7
1999 jun 15 10 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 characteristics symbol parameter conditions min. typ. max. unit v dd operating supply voltage 2.0 - 5.5 v i dd supply current v dd =5v; t amb =25 c -- 2ma i dd(q) quiescent current v dd =3v; t amb =25 c -- 1 m a t amb operating ambient temperature - 10 - +50 c sense lines (input only and will have a weak internal pull-up resistance) v il low level input voltage -- 0.3v dd v v ih high level input voltage 0.7v dd -- v r pu pull-up resistance v dd =2v 50 - 100 k w driver lines (output only; open drain; maximum on-resistance when low) r on maximum on-resistance v dd =2v -- 2k w output driver (has a weak pull-up resistance) i sink sink current v dd =2v; v o =1v -- 45 ma r pu pull-up resistance v dd =2v -- 5k w fig.6 rom schematic diagram. handbook, full pagewidth mbh036 m7h bs2 bs1 bs0 kn5 kn4 kn3 kn2 kn1 kn0 m6h m5h m4h m3h m2h m1h m0h m7l bank 7 msb m6l m5l m4l m3l m2l m1l m0l bank 6 msb bank 5 msb bank 4 msb bank 3 msb bank 2 msb bank 1 msb bank 0 msb bank 7 lsb bank 6 lsb bank 5 lsb bank 4 lsb bank 3 lsb bank 2 lsb bank 1 lsb bank 0 lsb rom 1k x 8 address
1999 jun 15 11 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 system development software (rc8521) a pc program is provided that enables the user to fill in system and command codes for each key number in each bank. this program converts the input data into a rom code-file needed to produce the metal mask and to program an eprom to be used in the hardware emulator. hardware (om4839) an emulator is available that functionally emulates the ic. an eprom with the rom code information is inserted into the emulator to produce the required remote control codes corresponding to the keys in the prototype device. application information fig.7 application diagram (for dip20 and so20 packages). handbook, full pagewidth mbh034 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 xtal1 xtal2 sn7 432 khz or 4 mhz sn0 sn1 sn2 sn3 sn6 sn4 sn5 v dd lout v ss dr6 dr0 dr1 dr2 dr3 dr4 dr5 PCA8521
1999 jun 15 12 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 internal pin configuration fig.8 pin configuration for pin sn0. mbh322 v dd v dd 4 fig.9 pin configuration for pins sn1 to sn7. mbh323 v dd v dd 3, 5 to 10 fig.10 pin configuration for pins dr0 to dr6. mbh324 v dd 11 to 17 fig.11 pin configuration for pin lout. mbh325 v dd v dd 19
1999 jun 15 13 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 package outlines references outline version european projection issue date iec jedec eiaj sot38-4 92-11-17 95-01-14 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 16 1 9 8 e pin 1 index b 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.030 0.17 0.020 0.13 dip16: plastic dual in-line package; 16 leads (300 mil) sot38-4
1999 jun 15 14 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot162-1 8 16 w m b p d detail x z e 9 1 y 0.25 075e03 ms-013aa pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a 0 5 10 mm scale so16: plastic small outline package; 16 leads; body width 7.5 mm sot162-1 95-01-24 97-05-22
1999 jun 15 15 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 unit a max. 1 2 b 1 cd e e m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot146-1 92-11-17 95-05-24 a min. a max. b z max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 6.40 6.22 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.0 4.2 0.51 3.2 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 0.25 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.078 0.17 0.020 0.13 sc603 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 20 1 11 10 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) (1) dip20: plastic dual in-line package; 20 leads (300 mil) sot146-1
1999 jun 15 16 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013ac pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 95-01-24 97-05-22
1999 jun 15 17 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. through-hole mount packages s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1999 jun 15 18 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. mounting package soldering method wave reflow (1) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (2) - suitable surface mount bga, sqfp not suitable suitable - hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (3) suitable - plcc (4) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (4)(5) suitable - ssop, tssop, vso not recommended (6) suitable -
1999 jun 15 19 philips semiconductors product speci?cation infrared remote control transmitter rc5 PCA8521 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. purchase of philips rc5 components data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. purchase of philips rc5 components conveys a license under the philips rc5 patent to use the components in rc5 system products conforming to the rc5 standard uatm-5000 for allocation of remote control commands defined by philips.
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st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 62 5344, fax.+381 11 63 5777 for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 34 waterloo road, north ryde, nsw 2113, tel. +61 2 9805 4455, fax. +61 2 9805 4466 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, piazza iv novembre 3, 20124 milano, tel. +39 02 67 52 2531, fax. +39 02 67 52 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy printed in the netherlands 545004/05/pp20 date of release: 1999 jun 15 document order number: 9397 750 06095

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